Chin Tuck Chien

Chin Tuck Chien is an experienced professional currently serving as the HPC AI Business Solution Manager for Asia at Vertiv since November 2019. Chin has held various roles within the company, including Senior Product Specialist for High Density & Rack Thermal and Product Engineer for Edge Thermal in Southeast Asia. Responsibilities include providing comprehensive product and technical support, developing sales tools, and enabling sales teams and partners with product knowledge. Chin's experience also encompasses a role as an Application Engineer offering technical advice and engineering design support for Vertiv Liebert products in data center environments. Notably, Chin was selected for the Vertiv Asia Sub-Region Young Talent Program, completing a diverse training curriculum across multiple countries. Prior work experience includes positions as a Data Entry Specialist at Sirius Communications and internships at Inta Bina Group Berhad. Chin holds a Bachelor’s degree in Mechanical Engineering (Honours) from Monash University Malaysia.