Yael Descalo

Principal, Solutions Engineering at Via

Yael Descalo is a seasoned technology professional currently serving as Principal of Solutions Engineering at Via since 2018, leading US operations and collaborating with global sales to enhance business development efforts. Previously, Yael was a Director of Software Engineering at NVIDIA, overseeing product development for high-performance computing solutions utilized by major cloud service providers and supercomputers. Earlier experience includes software engineering roles at Intel Corporation and serving as a Product Manager for Israeli Military Intelligence. Yael holds an MBA in Management of Technology, Innovation & Entrepreneurship from Tel Aviv University and a B.Sc in Electrical Engineering from the Technion.

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