Patrick Lavery is an accomplished engineering professional with extensive experience in materials science and electrical engineering. Currently serving as an Engineering Fellow and Senior Principal Engineer at Vicor since June 2014, Lavery has pioneered the development of innovative materials and procedures for 2D and 3D electronic packaging technologies, with a focus on enhancing epoxy molding compound adhesion in system in package electronic assemblies. Prior roles include Principal MEMS Process Design and Development Engineer at Lilliputian Systems and Principal Engineer at Vicor Corporation, where Lavery specialized in ROHS compliant materials and lead-free solder environments. Earlier career highlights include managing thin film manufacturing at Film Microelectronics and developing high-temperature coatings at United Technologies. Lavery holds a Master of Engineering in Materials Sciences and a Bachelor of Engineering in Metallurgical Engineering from Thayer School of Engineering at Dartmouth College, as well as an AB in Engineering Sciences from Dartmouth College.
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