Albert Chang

Albert Chang has a strong background in the semiconductor industry, with a focus on thin film processes. Albert started their career at TSMC Fab4 as a Process Engineer, where they were responsible for installation and maintenance of in-line measurement systems for copper film thickness. Albert then moved to TSMC Fab 3/6 as a Senior Process Engineer, where they evaluated copper barrier layer recipes for improved reliability and worked on copper CMP slurry evaluation for productivity and cost improvement. Albert later joined TSMC Fab 6 as a Principal Engineer and then transitioned into Wafertech as a Staff Process Engineer, leading process improvement projects and coordinating system transfers. Albert eventually became the Thin Film Process Manager and later the Thin Film Deputy Director, overseeing large teams and managing various thin film toolsets. In their most recent role as the Director of Engineering at WaferTech, Albert supervised the Thin Film Department, focusing on productivity improvements, recipe transfers, cost reduction, and process improvement. Albert also established systematic review mechanisms and promptly addressed any issues.

Albert Chang attended National Taiwan University of Science and Technology from 1990 to 1994, where they earned their Bachelor of Science degree in Engineering with a focus on Materials Science and Engineering. Albert further pursued their education at National Chiao Tung University from 1995 to 1997, completing a Master's Degree in Materials Science and Engineering.