Hao Wang

Hao Wang earned a Ph.D. in Aerospace, Aeronautical and Astronautical Engineering from Purdue University, where they also served as a Graduate Research Assistant and Teaching Assistant in various engineering courses. Prior to this, Hao completed a Master's degree in Material Science and Engineering at Stony Brook University and a Bachelor's degree in Aerospace Engineering from Tongji University. They have extensive experience in HDD wafer fabrication engineering and Chemical Mechanical Planarization (CMP) processes, having worked as a principal engineer at Western Digital and interned at Idaho National Laboratory. Hao possesses strong skills in statistical data analysis, finite element modeling, and cross-functional teamwork.