Hui Chen is a Principal Material Characterization/Failure Analysis Engineer with extensive experience in failure analysis, root cause analysis, and material characterization. Currently employed at Western Digital, they lead analytical characterization efforts for HDD media thin films and collaborate with global teams to drive product development and quality control. Previously, Hui held roles as a Senior Materials Scientist at Headway Technologies and a Senior Research Engineer at SAINT-GOBAIN, where they developed methodologies and supervised labs focusing on various materials. Hui earned a Ph.D. and an M.S. in Materials Science and Engineering from Stony Brook University and a B.S. in Inorganic Materials Science and Engineering from Tongji University.
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