Weishen Chu

Weishen Chu is a highly skilled professional in the field of engineering, currently serving as a Staff Engineer in R&D at Western Digital since 2021. They previously worked as a Research Assistant at The University of Texas at Austin, where they developed advanced models and conducted statistical analyses to enhance chip packaging reliability. In addition, they held positions as a Packaging Engineer at Inphi Corporation and a Graduate Intern at Cadence Design Systems, focusing on FEA modeling and optimization. Weishen earned a PhD in Mechanical Engineering from The University of Texas at Austin, alongside master's degrees in Materials Science and Engineering from Northwestern University and in Computer and Information Technology from the University of Pennsylvania.