WHOOP
Bill Diken

BD

Bill Diken

Senior Director Of Embedded Engineering at WHOOP

About

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Manager

Eric Chu

SVP Of Software Engineering

Peers

Corby Wilson

Principal Software Architect

Brian Martins

Director Of Electrical Engineering

James Goss

Director Of IT

Reports

Mark Pirri

Staff Engineering Manager

Timeline

Senior Director Of Embedded Engineering
February, 2023 - present
Director Of Embedded Engineering
February, 2020
Firmware Team Lead
October, 2019
Senior Firmware Engineer
October, 2018

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