Bill Diken

Bill Diken is an accomplished engineering professional with extensive experience in embedded and software engineering. Currently serving as Senior Director of Embedded Engineering at WHOOP since October 2018, Bill has held various positions including Director of Embedded Engineering and Firmware Team Lead. Prior to WHOOP, Bill worked as Lead Software Engineer at Backcountry Access, Inc., and held senior engineering roles at Qualcomm and Rockwell Collins. Bill began a career in IT coordination at the University of Iowa - International Programs. Educationally, Bill holds a Masters of Science and a Bachelor of Science in Electrical and Computer Engineering, along with minors in Computer Science and Economics, all from the University of Iowa.