Ee Lin Chung is a Staff Engineer in Package Development and Project Management at Wolfspeed, with a robust background in package technology. They worked as a Staff Engineer and Senior Development Engineer at Infineon Technologies from 2018 to 2019, and held the position of Staff Engineer II at Amkor Technology Malaysia from 2019 to 2023, focusing on package development, new materials, and materials analysis. Prior to this, they gained valuable experience as an Engineer at Carsem from 2010 to 2015, where they specialized in die attach paste characterization and project leadership for engineering builds. Ee Lin earned a Master of Science in Materials Engineering from Universiti Sains Malaysia Engineering Campus, and has been involved in their education at St. Michael's Institution Ipoh.
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