Andrew Holfus

Andrew Holfus is an experienced engineering professional currently serving as the Wide Band Gap Process Integration Manager at X-FAB since October 2016, where responsibilities include managing silicon carbide device technologies and driving continuous process improvements. Prior roles at X-FAB included Product Engineer focused on sustaining and enhancing yield for CMOS and silicon carbide devices, and Quality Systems Engineer, ensuring compliance with quality certifications and conducting risk assessments. Andrew also worked as a Metrology Engineer II at Samsung Austin Semiconductor, specializing in recipe setup and measurement optimization for semiconductor manufacturing. Andrew's career began in the US Navy as a Missile Technician on the USS Maine, where technical skills were honed in maintaining and troubleshooting ballistic missile systems. Andrew holds a Bachelor’s Degree in Electrical and Electronics Engineering from Texas Tech University.