Hoi Kwan

Hoi Kwan is a dedicated engineering professional with extensive experience in semiconductor processing and equipment engineering. Currently serving as a Senior Field Service/NPI Product Engineer at Yield Engineering Systems since August 2025, prior roles include Product Support Engineer and Equipment Engineer at ASM, where responsibilities encompassed ownership of semiconductor processing modules, development of best known method documents, and conducting preventive maintenance on Atomic Layer Deposition equipment. Hoi's earlier experience includes working as a Module Equipment Engineer at TSMC, where training and toolset monitoring were key duties, as well as a Mechanical Engineering CO-OP at ASM Pacific Technology Ltd., enhancing data processing methods. Hoi holds a Bachelor's degree in Mechanical Engineering from Rensselaer Polytechnic Institute.