Liana Jackson

Liana Jackson is a Senior Advanced Packaging Manufacturing Engineer at American Semiconductor since June 2021, focusing on packaging flex sensors and antennas. Prior to this role, Liana spent 20 years at Micron Technology, where responsibilities included serving as a Process Control Engineer, Process Engineer, Assembly Product Technician, and Equipment Maintenance Technician, with expertise in areas such as R2R - CMP, WP, DWS, and data analysis. Educational qualifications include a Bachelor of Science in Materials Science & Engineering with minors in Physics, Mathematics, and Biomaterials from Boise State University, as well as an Associate of Applied Science in Electronics and Computer Technology from DeVry Institute of Technology.