Amkor Technology
Dale Robinson is an experienced professional in the engineering and technology sectors, currently serving as Sr Director at Amkor Technology, Inc. since July 2007. In this role, Dale specializes in product management for fcCSP/fsCSP and hybrid packaging, collaborating with customers and internal teams to align product capabilities with customer needs and facilitate new product introduction. Previously, Dale held positions such as VP of fcCSP Advanced Products Business Unit at House Medic Handyman and President at Motorola - Freescale Semiconductor. Dale's extensive experience also includes roles as Staff Manager in BAT-1 Operations and Staff Engineering Manager at Motorola, as well as Assembly Engineering Manager at Unisys. Dale holds a Bachelor's degree in Metallurgical Engineering from the University of Utah, earned from 1979 to 1983, and graduated with honors from Woods Cross High School in 1979.
Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.