Amkor Technology
Doug Scott is a seasoned professional in the semiconductor industry with extensive experience in engineering and leadership roles. Currently serving as the Senior Vice President of Wafer Services Business Unit at Amkor Technology since January 2015, Doug previously held the position of Senior Director of Engineering at FlipChip International from March 2005 to January 2015. Earlier in their career, Doug worked as a Process Engineer III at Tokyo Electron from 2001 to March 2005. Academic credentials include a Master of Business Administration from W. P. Carey School of Business at Arizona State University, a Master of Science in Chemistry, and a Bachelor of Science in Chemistry, both obtained from Western Washington University.
Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.