Amkor Technology
HoJeong Lim has extensive experience in the semiconductor industry, currently serving as the Director of IC Packaging Design and previously as the Director of IC Packaging Integration/Design & Simulation at Amkor Technology, Inc. Prior to this, HoJeong Lim held the position of Sr. Engineer at GLOBALFOUNDRIES, showcasing a strong background in integrated circuit packaging and design.
This person is not in any teams
This person is not in any offices