Amkor Technology
Jon Aday is an experienced professional in advanced packaging technology with a career spanning multiple key roles in the semiconductor and biotechnology industries. Currently serving as VP of Advanced Packaging Technology Integration at Amkor Technology, Inc. since January 2021, Jon previously held positions including Sr. Staff Engineer at Illumina, where support was provided for new product development in DNA sequencing consumables. Prior roles at Qualcomm involved driving semiconductor packaging technology development and managing engineering teams. Jon's extensive experience includes significant contributions to FlipChip International and multiple roles at Amkor Technology, where leadership was demonstrated in high-performance flip chip products. Education includes a Master's and Bachelor's degree in Electrical Engineering from Auburn University.
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