Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

Semiconductor

Amkor Technology

Giel Rutten

Megan Faust

John Stone

Mark Rogers

Steve Shin

The Technology and Engineering Team at Amkor Technology is responsible for driving innovation and advancements in semiconductor packaging and testing processes. This team oversees the development and integration of cutting-edge technologies, collaborates on package design and engineering solutions, and ensures that services meet the specific requirements of integrated device manufacturers and fabless semiconductor companies. By leveraging their expertise, the team aims to enhance performance, reliability, and efficiency in semiconductor packaging and testing.

Technology and Engineering Team

Operations and Facilities Team

Human Resources and Governance Team

Technology and Engineering Team

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Other teams at Amkor Technology

Operations and Facilities Team

Human Resources and Governance Team