Howard Lai

Howard Lai is an experienced manager in package development and engineering, currently serving as Manager for AOS Subcon product development at ams OSRAM since April 2019. In this role, Howard leads a cross-country team to oversee new package development processes in OSATs across Asia, implementing guidelines and risk assessments to ensure project quality and timelines. Previous positions include Sr. Staff Engineer at ams OSRAM, where Howard managed various light and dToF sensor package development projects, and a Sr. Engineer role at Realtek Semiconductor Corp., focusing on automotive Ethernet products. With extensive experience at companies like ASE Group and Powertech Technology, Howard has honed expertise in packaging integration for automotive applications and innovative technology solutions. Howard holds a Master of Science in Geology/Earth Science from National Taiwan University.