Ankur Agrawal is a highly experienced engineering professional with a strong background in silicon photonics packaging and semiconductor IC packaging. At Intel Corporation, Ankur served as a Principal Engineer and Engineering Manager, overseeing the development of IC packaging for silicon photonics products and leading multi-geo teams in bumping and assembly solutions. Other roles at Intel included Principal Engineer and Chief of Staff in Design Enablement, as well as positions managing teams focused on Silicon Integration and Platform Systems Engineering. Ankur's expertise encompasses delivering complex package architectures and optimizing design rules for cost and performance. Currently, Ankur is contributing as an IC Packaging Engineer at Apple. Ankur holds a Ph.D. in Chemical Engineering from Georgia Tech and a B.Tech. in Chemical Engineering from the Indian Institute of Technology, Kanpur.
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