Dan Greenberg is an experienced Mechanical Engineer with a strong educational background, holding both a B.S. and M.S. in Mechanical Engineering from California Polytechnic State University-San Luis Obispo. Dan began a professional career as a Hardware Engineering Intern at Teradata in 2008, followed by a Mechanical Engineering Intern position at Western Digital in 2010. Dan then served as a Mechanical Engineer at Applied Materials from July 2011 to May 2014 and has been working at Apple as a Mechanical Engineer since May 2014.
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