Palash V. Acharya

Packaging Thermal Engineer- Silicon Engineering Group at Apple

Palash V. Acharya is an accomplished thermal engineer with experience in the semiconductor industry and research environments. Currently serving as a Packaging Thermal Engineer in the Silicon Engineering Group at Apple, Acharya has previously held the position of SoC Thermal Engineer at Qualcomm. Additional experience includes a role as a Graduate Research Assistant at The University of Texas at Austin and an internship focused on SoC Thermal Engineering at Qualcomm. Acharya also gained valuable insights during a graduate internship at the National Renewable Energy Laboratory, where the focus was on the modeling of thermal energy storage materials.

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