Akshay Kedia is a semiconductor professional with over ten years of experience in process development and technology R&D. They have held various roles, including Engineering Manager and Director at Applied Materials, where they currently lead technology strategy in logic and advanced packaging. Akshay has a strong background in managing cross-functional teams of PhD engineers and has made significant contributions to lithography and advanced packaging technologies, achieving substantial efficiency improvements and cost savings. They earned a Ph.D. in Materials Science from the University of Southern California, complemented by multiple US patents and over 2000 citations in their field.
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