Arteris
Gabriel Yin has a wealth of experience in the technology industry, with a focus on sales and management roles. Gabriel currently serves as the VP of Sales, Greater China at Arteris IP, a position they have held since October 2021. Prior to this, Gabriel worked at Arteris IP as the Country Manager from March 2018 to October 2021. Before joining Arteris IP, Gabriel was the VP at Dodsun starting in February 2014. Gabriel joined Synopsys in March 2008 and held the positions of Product Solution Sales Manager from March 2010 to January 2014 and Senior Account Manager from March 2008 to March 2010. Gabriel's career began at KLA-Tencor in 1999, where they served as a Senior Applications Engineer until 2003 and then transitioned into the role of Account Manager until 2006. Throughout their career, Gabriel has demonstrated expertise in sales, leadership, and technology solutions.
Gabriel Yin has a strong academic background in Chemical Engineering. Gabriel completed their Bachelor of Science (B.S.) degree in Chemical Engineering from the University of California, Los Angeles from 1994 to 1997. Gabriel further pursued their education in the same field and obtained a Master of Science (M.S.) degree in Chemical Engineering from Stanford University in 1998-1999.
In addition to their formal education, Gabriel Yin has also obtained several certifications in the field of Machine Learning and Artificial Intelligence. Gabriel completed a range of courses on Coursera, including "Deep Learning Specialization," "Sequence Models," "Convolutional Neural Networks," "Improving Deep Neural Networks: Hyperparameter tuning, Regularization and Optimization," "Structuring Machine Learning Projects," and "Neural Networks and Deep Learning." These certifications were obtained between 2017 and 2019.
Based on the available information, Gabriel Yin's education and certifications suggest a strong foundation in Chemical Engineering, complemented by a significant focus on expanding their knowledge and skills in the field of Machine Learning and Artificial Intelligence.
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Arteris
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Arteris is helping power the next wave of autonomous driving, 5G and Artificial Intelligence (AI) systems fueling the growth the of the semiconductor industry. Our Network-on-Chip (NoC) interconnect semiconductor intellectual property (IP) is the on-chip communications backbone of most of the world’s most important and sophisticated systems-on-chip(SoC). Optimizing on-chip dataflow and connectivity is the cornerstone of our vision for system-on-chip development and assembly. Since our inception in 2003, we have pioneered the development and commercialization of NoC interconnect technology, cementing our position as the world’s first and largest commercial NoC interconnect IP company. Our unique technology meets the needs for cache coherent and non-coherent on-chip communications, on-chip data caching, and on-chip data protection to meet functional safety requirements.ARTERIS IP PRODUCTS AND SOLUTIONSOur on-chip NoC-based interconnect IP products make systems-on-chip easier to develop, perform better, and faster to get to market.The Arteris IP product portfolio meets the needs of design teams creating nearly any type of digital logic SoC with any type of communications semantics. Our seminal FlexNoC® Interconnect IP pioneered the market for NoC interconnects and is the industry leader. The highly configurable Ncore® Cache Coherent Interconnect IP allows optimal integration of cache-coherent Arm®-based processor IP with other cache-coherent and non-coherent IP.The growth of Artificial Intelligence (AI) and Machine Learning (ML) has inspired the creation of two innovative products. The Arteris IP AI Package is an option to Arteris FlexNoC that provides automated means to create complex topologies (meshes, rings, and tori) while adding multicast/broadcast communications, virtual channels, and source-synchronous communications to meet the unique needs of AI/ML chips. The CodaCache® Last Level Cache provides a highly configurable cache that can be instantiated anywhere within an SoC interconnect, providing data locality wherever needed.To meet the needs of the new generation of multibillion-transistor chips for automated systems with functional safety requirements, Arteris IP also offers Resilience Packages that provide hardware-based data protection technologies as well as automated diagnostic coverage analysis to help meet requirements ISO 26262 and IEC 61508 functional standards. Resilience Packages are available for FlexNoC, Ncore and CodaCache IP products.Timing closure has become a key design schedule constraint as chips have grown in size and complexity and semiconductor manufacturing process critical dimension have shrunk. To address this, Arteris IP created the PIANO® Timing Closure Package which provides physical and timing information about the interconnect to back-end synthesis place and route tools to help ensure faster timing closure.