John Golightly

Vice President Global Head Sustainability | Climate | Global EHS at ASM International NV

John Golightly is an accomplished professional in sustainability and environmental health and safety with extensive experience in the semiconductor industry. Currently serving as Vice President and Global Head of Sustainability, Climate, and Global EHS at ASM since August 2012, John has a track record of developing comprehensive strategic planning to enhance performance across engineering, research and development, manufacturing, and supply chain operations globally. Prior to ASM, John held positions as Senior EHS Manager at Lam Research, where responsibility spanned global EHS and occupational health programs for over 2300 employees, and as Senior EHS Engineer at Novellus Systems, managing EHS programs at the Oregon campus. John's career began as Corporate EHS Manager at Great Western Chemical, overseeing compliance programs across multiple operations. John holds a Bachelor of Science degree in Chemistry from the University of Arizona.

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Portland, United States

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ASM International NV

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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.


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1,001-5,000

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