Evgeny Abramov is a Staff Process Engineer at Atomica, where responsibilities include leading a team focused on the availability and stability of manufacturing processes such as electroplating, wet-etching, bonding, grinding, CMP, and dicing, while also supporting and developing production processes since August 2019. Previously, Evgeny served as a Process Engineer at ALLVIA, Inc., contributing to the development and manufacturing of TSV/TGV processes, including laser drilling. Evgeny has also worked at OmniVision Technologies, Inc., overseeing wafer-level processes including dicing, bonding, imprint lithography, and precise dispensing, and at Tessera, where 13 years of experience in wafer dicing for semiconductor and optical industries was gained, specializing in dicing of various materials.
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