BE Semiconductor Industries NV
Sergii Nevmyvanyi currently serves as the ESG Manager at BE Semiconductor Industries N.V. since June 2023. Prior experience includes a tenure at the International Finance Corporation from April 2010 to June 2023, where Sergii held the position of Senior Sustainable Finance Specialist in the Financial Institutions Group, focusing on developing sustainable finance initiatives and investment in green technologies. Additionally, Sergii worked as the Resource Efficiency and Sustainable Investment Specialist, managing teams to demonstrate the benefits of resource efficiency investments and engaging with policymakers on climate change opportunities. Earlier roles include Visiting Lecturer at MIM-Kyiv Business School and Project Manager at Envitec, as well as experience as a Process Engineer at Chr. Hansen A/S. Educational qualifications include a Ph.D. in Biotechnology, a Master's in Fermentation Technology, a Bachelor's in Accounting and Audit, and a Pre-MBA in Financial Management from Harvard Business School Online.
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BE Semiconductor Industries NV
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BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.