BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Electronics

Marketing

BE Semiconductor Industries NV

Richard Blickman

Robert Kruithof

Sander Liefveld

René Hendriks

J.K. Park

Henk-Jan Jonge Poerink

Bart Berenbak

Jeroen Kleijburg

Peter Wiedner

Christoph Scheiring

Ruurd Boomsma

The Leadership Team at BE Semiconductor Industries NV is responsible for setting the strategic direction and overseeing the operational execution of the company's initiatives across its Die Attach, Packaging, and Plating segments. This team, consisting of senior executives from various functional areas, collaborates to drive innovation in semiconductor assembly equipment, enhance global sales and customer support, optimize operations, and ensure financial sustainability, ultimately positioning Besi as a leader in the semiconductor and electronics industries.

Leadership Team

Operations and Financial Management

Leadership Team

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Operations and Financial Management