Roger Connell is an experienced Packaging Engineer currently employed at BD since July 2022, where responsibilities include coordinating equipment installation and conducting gap analyses for standard operating procedures. Previously, Roger served as Platform Development Manager at Footprint from June 2019 to July 2022, focusing on the developmental pathway to high-volume manufacturing for new technologies and outlining customer-driven specifications. Prior roles also include Sales Project Manager at Footprint and Packaging Engineer at Ecolab, where Roger developed package testing procedures and collaborated with suppliers for material performance improvements. Roger began a career as an Operator at Vets Plus, Inc., managing equipment for production processes. Roger holds a Bachelor of Applied Science in Packaging Engineering from the University of Wisconsin-Stout, earned in 2019.
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