Frank Heinle

Frank Heinle is a distinguished engineer specializing in cellular architecture at Bridgecom Semiconductors since February 2023. Prior experience includes roles as Terminal Chipset Architect at Huawei Deutschland from January 2020 to January 2023, and System Architect for Cellular Modems at Intel Corporation from November 2012 to January 2020. Other notable positions include Principal Member of Technical Staff in System Design at ST-Ericsson, Senior Principal and System Architect at ST-NXP Wireless, and similar senior roles at NXP Semiconductors and Philips Semiconductors. Frank's early career involved research in multirate signal processing as a PhD student at the University of Erlangen-Nuremberg. Educational credentials include a PhD in Digital Signal Processing and Communications and a Master's degree in Electrical and Electronics Engineering, both from FAU Erlangen-Nuremberg.