HJ

Hoyoun Jang

Director at Calient Technologies

Hoyoun Jang has over 25 years of professional experience. In 1994 and 1995, they completed internships at Daewoo Electronics and Hyundai Heavy Industries Co., Ltd, respectively. From 2000 to 2004, they were an Entrusted Researcher at the KIST (Korea Institute of Science and Technology) Biomechanics Lab, where they participated in the Wear Simulator Project. In 2004, they became a Process Engineer (MEMS) at Calient Optical Components, Inc. and contributed to Calient's 3-D MEMS product development efforts. From 2006 to 2017, they worked as a Principal MEMS Process Engineer at Futurewei Technologies, Inc., where they remotely worked at CNF (Cornell Nanofabrication Facility) to make prototypes, developed and improved all the processes (FEOL & BEOL) of magnetically driven MEMS mirrors for LIDAR and Optical Cross Connect applications, and received an Outstanding Contribution Award and Presidential Team Award. In 2019, they became a Principal MEMS Process Engineer at Soundskrit, where they delivered prototypes of bio-inspired, directional MEMS microphone which measures the velocity of incoming sound rather than pressure, developed all the processes, FA, and DOE's at CNF (Cornell Nanofabrication Facility) and LNF (Lurie Nanofabrication Facility - Univ. of Michigan Ann Arbor), and worked with various membranes and structures. Currently, Hoyoun Jang is the Director at CALIENT Technologies Inc.

Hoyoun Jang's education history includes a Bachelor of Science (BS) in Precision Engineering & Mechatronics from the Korea Advanced Institute of Science and Technology (KAIST) between 1992 and 1995, followed by a Master of Science (MS) in Mechanical Engineering from KAIST between 1995 and 1997. Hoyoun then earned a Master of Science (MS) in Biomedical/Medical Engineering from Cornell University between 2001 and 2004. Prior to that, Hoyoun Jang attended Kwangju Science High School (광주과학고등학교) between 1990 and 1992.

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Previous companies

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Timeline

  • Director

    June, 2020 - present

  • Principal MEMS Integration Engineer

    August, 2006

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