Shu-Hsuan Kuan

Shu-Hsuan Kuan has been working in the engineering field since 2009. Shu-Hsuan began their career at Inventec as a Mechanical Engineer, where they provided RFQ reports, checked parting lines, groove spacing, gaps and stacking feasibility at the forehead. In 2010, they moved to Compal Communications, Inc. as a Mechanical Engineer, where they provided RFQ reports, narrowed borders and dead bands, and minimized device size. In 2014, Kuan started working at Truly Semiconductors Ltd. as a Field Application Engineer, where they supported forehead TP drawing checks and design reviews with customers to ensure design criteria were met. Shu-Hsuan has been working at CapsoVision, Inc. as a Mechanical Engineer since 2017.

Shu-Hsuan Kuan attended National Chiao Tung University from 2005 to 2009, studying mechanical engineering. Shu-Hsuan also attended Taipei Municipal Jinwen University, though the duration of their studies is unknown.