Gregory M. Johnson is an accomplished engineering professional with extensive experience in semiconductor failure analysis and application development. Currently serving as a Senior Application Development Engineer at ZEISS Group since November 2018, Gregory collaborates with customers and industry partners to enhance electron microscopy applications for the semiconductor industry. Previous roles include Failure Analysis Engineer at Defect Localization and Senior Member of Technical Staff at GLOBALFOUNDRIES, where Gregory coordinated lab teams for advanced diode characterization. Prior to that, Gregory spent 25 years at IBM in various roles, including Semiconductor Failure Analysis Engineer and Bond Assembly & Test Engineer, contributing to significant advancements in semiconductor technology. Gregory's academic background includes a B.S. in Materials Engineering from Virginia Tech and graduate research in Materials Science and Engineering at the University of Florida.
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