Will Findlay

Will Findlay has a diverse work experience in engineering. Will began their career in 2012 as a Software Engineer Intern at Intel Corporation, where they maintained the Media Catalog on the product website, performed regression testing, and developed a set of tools to automate the regression testing procedure using Selenium. In 2013, they worked as a Research Assistant at Stanford University, where they analyzed supersonic jet noise simulations, verified the quality of the simulated near-field data through mass and momentum balances, and compared near-field acoustic spectra of the simulated data with experimental data. In 2014, they were a Mechanical Engineering Intern at Northrop Grumman Corporation, where they created assemblies and drawings of relevant systems using CATIA, drafted release documentation for updated components, and helped drive affordability initiatives. In 2015, they worked as a Course Assistant at Stanford University for ME 140: Advanced Thermal Systems and ENGR 30: Engineering Thermodynamics, where they held office hours, drafted weekly problem sets, lead weekly tutorials, led exam review sessions, drafted exams, and graded exams. Finally, in 2018 they began working at CelLink Corporation as a Senior Design Engineer and Applications Engineer, where they worked on www.CelLinkCircuits.com, and as a Design Consultant.

Will Findlay completed their Bachelor of Science (B.S.) in Mechanical Engineering from Stanford University in 2015. Will then went on to pursue a Master of Science (M.S.) in Mechanical Engineering from the same university.