William Murphy is a seasoned engineering professional with extensive experience in thin film processes and semiconductor manufacturing. Currently serving as a Senior Thin Film Process and Strategy Engineer at Chroma Technology Corp. since March 2021, William has honed expertise in thin film deposition and equipment strategy. Previously, as a Distinguished Member of Technical Staff at GLOBALFOUNDRIES from April 2016 to March 2021, William contributed as a Program Manager for RF-SOI switch technologies, focusing on yield, quality, and multi-fab alignment. William's background also includes roles as a Senior Technical Staff Member at both GLOBALFOUNDRIES and IBM, along with an engineering position at Applied Materials, emphasizing a robust career spanning over three decades in the semiconductor industry.
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