Jasper Chang is an experienced professional in mechanical engineering and quality management with a strong background in various industries. After starting as a metal tooling engineer at Wing Multiply Forging Co., Ltd., Jasper progressed to senior roles in reputable companies such as Inventec and Compal Electronics, INC. Responsibilities have included managing mechanical quality for HP Business Notebook products, overseeing sourcing and development of mechanical enclosure parts for smart devices, and utilizing 3D CAD for product design. Education was completed at Tungnan University with a Bachelor’s degree in Civil Engineering.
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