Mike H.

Mike H. is a skilled Thermal Design Engineer currently working at Compal as a Senior Thermal Engineer. They previously held roles as a Design Leader and worked at 仁寶 as a Thermal Design Engineer from 2020 to 2023. Prior to that, Mike served as a Mechanical Engineer at 廣達電腦, where they focused on product design for wearable devices and managed various stages of the product lifecycle. Mike holds a Master's degree from 國立臺灣大學, which they earned between 2015 and 2018.