Corintis
John C. is an experienced professional currently serving as a Senior Technical Program Manager at Corintis since September 2023. Prior to this role, John worked at Amazon Web Services (AWS) from December 2019 to July 2023 in various capacities including Technical Program Manager, Controls Program Manager, and Controls Project Engineer. John’s earlier career includes positions as a Controls Engineer at Wunderlich-Malec Engineering, Senior Power Systems Automation Engineer at Eaton, and Controls Engineer at SDI.systems, among others. John’s academic qualifications include two Master of Science degrees from the University of Arizona in Electrical and Computer Engineering and from the Florida Institute of Technology in Ocean Engineering, along with a Bachelor of Science in Engineering Physics from Colorado School of Mines. John also completed professional education at MIT from May 2022 to August 2023.
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.