Corintis
Miguel Angel Salazar de Troya, Ph.D., is currently the Head of Software Engineering and Thermal Modelling and Simulation Engineer at Corintis, where the focus is on developing an automated design platform for microfluidic cooling devices. Prior to this role, Miguel Angel Salazar de Troya served as a Postdoctoral Researcher at Lawrence Livermore National Laboratory, concentrating on automating industrial design processes, specifically for heat exchangers, batteries, and fuel cells, and notably developed a Python topology optimization library. Miguel Angel Salazar de Troya also contributed as a Lawrence Scholar at the same laboratory, where a large-scale topology optimization framework was created for solid mechanics. Earlier experiences include a summer internship at ExxonMobil, conducting numerical simulations, and research assistant positions at the University of Illinois at Urbana-Champaign and the University of Granada, focusing on optimization and material design. The academic qualifications include a Ph.D. and a Master’s in Mechanical Engineering from the University of Illinois Urbana-Champaign and a degree in Civil Engineering from Universidad de Granada.
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.