Hariprasad Gangadharan

Head of Silicon Engineering at EdgeQ

Hari has 25 years of communications experience and modem development having worked at Qualcomm, Intel, Broadcom/Beceem, and Cypress. He has built and led large organizations for the Design and Execution of diverse SOCs including Framer Chips, Baseband Modems, Base station modems and Signal Processing hardware for RFIC’s. Earlier in his career, he was the Design Engineering Director and the Modem HW lead at Beceem which was later acquired by Broadcom. At Qualcomm, he worked to define the Chipset Architecture of the Snapdragon Chips. He joined EdgeQ from Intel where he was Director of Engineering.

At EdgeQ, Hari leads all facets of design, architecture, systems, IP and implementation. Hari obtained a Bachelors of Technology from National Institute of Technology Calicut and holds 4 US patents.

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