Alexis Trivella

Alexis Trivella has held a variety of roles in the tech industry since 2013. Alexis began their career as a Stagiaire Ingénieur Conception Électronique at Schneider Electric in 2013. In 2015, they were a Stagiaire Ingénieur Logiciel et Réseaux at Unesp, where they developed and implemented a network of sensors for energy efficiency. Alexis then moved to Digigram in 2016, where they were a Stagiaire Ingénieur Système Embarqué and was responsible for the conception of an audio bridge prototype between audio over IP (AES67) and digital/analog audio. From 2016 to 2019, they worked at ADENTIS, first as an Ingénieur d'Etudes and then as a Firmware Developer. During this time, they were responsible for the conception of embedded systems based on Bluetooth technology, multi-processor systems, and optimizing consumption. Alexis also developed C component drivers and performed tests and validations. Finally, they were the Application Support Team Lead at eLichens from 2019 to present.

Alexis Trivella attended IUT 1 Grenoble from 2011 to 2013, where they earned a DUT Génie Electrique et Informatique Industrielle. Alexis then attended Polytech Grenoble from 2013 to 2016, where they earned an Ingénieur Département Informatique Industrielle et Instrumentation.