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Dan Buday

Hardware Engineering Lead

Dan Buday is currently a Hardware Engineering Lead at Emerson, where they apply their extensive expertise in electrical design and engineering. With a background that includes roles as a Senior Electrical Engineer at GOJO Industries and IEC Infrared, Dan has developed a robust skillset in circuit design, PCB layout, and embedded programming. They hold a Master of Business Administration from The University of Akron and a Bachelor of Science in Electrical Engineering from Cleveland State University. Dan's journey in engineering began after earning a Bachelor of Arts from The Ohio State University.

Location

Medina, United States

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