FlipChip International, LLC
David Lawhead is a retired professional with extensive experience in engineering, particularly in the fields of flip chip technology and process development. Lawhead worked at Flip Chip Technologies from 1997 until August 2023, where the role of F/A and Process Development Engineer was held. Prior to retirement in September 2019, Lawhead contributed to FlipChip International as an Engineer.
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FlipChip International, LLC
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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.