Eric Zhang

Eric Zhang has extensive experience in the field of materials chemistry, serving as a Process Engineer at FlipChip Shanghai since June 2006, where responsibilities include transferring advanced bumping technology and mastering elite processes such as Electroless Nickel and Gold plating. Previously, Eric held a position as a Visiting Researcher at the Institute of Physics Czech Academy of Science in Prague, conducting sophisticated spectroscopy analyses for cooperative projects. Additionally, Eric gained practical experience in alkyl sulfonic synthesis during an attendee role at the HeNan MaoDun Group. Eric holds a Master's degree in Materials Chemistry from East China University of Science and Technology and a Bachelor's degree in Chemistry from Zhengzhou University of Light Industry.