Ha Le has extensive experience in engineering, spanning over three decades. Currently a Product Engineer at FlipChip International since March 2014, Ha Le previously held the same position at Freescale Semiconductor from August 2006 to December 2012, focusing on the lifecycle management of RF IC products. Prior to that, Ha Le worked at Freescale Semiconductor Inc./Motorola, Inc. as a Process Engineer, leading teams in scanning electron microscopy and related technologies, and at Motorola, Inc. as a Process Engineer overseeing the qualification of various processes. Ha Le's career began at Motorola Inc. as an Electronic Engineer, responsible for assembling teams for cost estimations on projects. Ha Le holds a Bachelor of Science degree in Electrical Engineering from the University of Houston.
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FlipChip International, LLC
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FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.