Daniel Witte is currently a Lead Thermaldynamics Engineer at GE Aerospace. They hold both a Bachelor's and a Master's degree in Mechanical Engineering from Northeastern University, where they studied from 2015 to 2019. Previously, Daniel has held various roles, including Thermaldynamics Engineer at GE Aerospace and Mechanical Design Engineer at Analogic, where they contributed to the design and development of medical CT equipment. Daniel's early experience includes a Research Assistant position with the Yongmin Liu Research Group and a Chemist role at LabChem Inc. They are open to new experiences and aspire to engage with cutting-edge technology.
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