WD

Wenjing Dai

Mechanical Engineer

Wenjing Dai is an Electromechanical Engineer at Northrop Grumman since November 2017. Prior to that, Dai worked as a Mechanical Engineer at General Micro Systems starting in October 2015. Dai obtained a Bachelor of Science in Mechanical Engineering from the University of California, Berkeley in 2014.

Location

Ontario, United States

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