Nabeel Zafar is an accomplished IC packaging engineer currently working at Google, focusing on IC packaging solutions. Previously, Nabeel held significant roles at Cummins Inc., Intel Corporation, and Amkor Technology, where they led cross-functional teams to enhance product reliability and resolve engineering challenges. With a Master's degree in Mechanical Engineering from Indiana University–Purdue University Indianapolis and a Bachelor's degree in the same field from Arizona State University, Nabeel brings extensive expertise in mechanical simulations and process development to their work.
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