Klaus Essig is an experienced engineer currently serving as Engineer Hardware Analysis and Customer Quality (teamlead deputy) at HARMAN International since September 2020. Responsibilities include hardware analysis, root cause investigation, technical project management, and quality control, alongside providing customer support and facilitating cross-functional collaboration. Prior roles at HARMAN encompass dual student positions in electrical engineering and mechatronics, focusing on WiFi and Bluetooth antenna optimization and project management. Klaus has also gained practical experience as a technician in energy and building technology at Klinikum Mittelbaden and has worked internationally as an electrician in Canada. Educational background includes degrees in electrical engineering and mechatronics from Duale Hochschule Baden-Württemberg and certifications in energy and building technology.
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