Danbo Deng is a Senior Staff ASIC Verification Engineer at HUAWEI, specializing in 5G base station chips verification since 2016. Previously, Danbo worked as a VLSI verification engineer focusing on ARM and Low-Power systems at重邮信科 from 2009 to 2011, and served as an ASIC verification engineer at AMD from 2011 to 2012. At Conexant, from 2012 to 2016, Danbo led VLSI verification for PC-Codec products. Danbo holds a Bachelor's degree in Mechanical Engineering from Jilin University and a Master of Engineering in Electronic Engineering from the University of Chinese Academy of Sciences.
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