Brian Erwin is an accomplished professional in the field of materials science and engineering, with extensive experience in microelectronic packaging and research. Notable positions include postdoctoral researcher at the Foundation for Research and Technology - Hellas and ESPCI, where Brian focused on colloidal solutions and soft materials. Brian's tenure at IBM included roles as an engineer in packaging failure analysis and diagnostics, as well as microelectronic packaging development, where advancements in materials and manufacturing processes were emphasized. Additional engineering and management roles at GE Silicones contributed to improving manufacturing processes and increasing product revenue. Educational qualifications include a Ph.D. in Materials Science and degrees in Chemical Engineering from Penn State University and the University of Rhode Island.
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